Water-Cooled Server

To achieve this disruptive power density in a liquid cooled server, two things are required:

(i) create a Microelectronic Module that is much smaller than equivalent cold plate solutions.

(ii) provide a high cooling level to the modules in a server.

In addition to excellent thermal performance the proposed solution provides additional benefits: it is mass-producible at low cost, with few components and a high level of automation, and it enables a fast ramp to high volume production.