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1885 Springer Rd Unit B

Mountain View, CA 94040-4052

Salmon Engineering was formed in 2019 to explore new technology for densely packed electronic systems, especially water cooled modules and servers. This endeavor builds on 30 years of product ideas for interconnecting, testing, and cooling semiconductor systems.

Artificial Intelligence (AI) is driving new demand for giga-scale data centers. Ever-increasing power density invites a fresh cooling approach, “from chip to chiller”.

We offer a new thermal paradigm that will bring competitive thermal performance, lower design and manufacturing costs, and a faster ramp to high volume production.

  • The industry is facing headwinds due to thermal
    limitations. The proposed thermal solution is so
    powerful that many conventional design rules can be
    safely ignored, greatly simplifying the design process.
  • Our patented thermal solution opens the door to a
    host of related benefits: improvements in power
    density, energy efficiency, design cost and
    manufacturing cost.
  • Increased component density further enables agile
    reconfiguration and workload adaptability, with
    available space for redundant components.
  • The proposed water-cooled modules can be
    integrated into advanced servers, and the servers
    integrated into advanced supercomputers.

We offer a new thermal paradigm

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