Thermal Performance

Thermal Performance

Test results from our lab:

Flow rate and pressure from our test device can both be linearly scaled* to produce specs for a server board.

  1. At a power dissipation of 0.1 watts per square millimeter, as for the board layout described on the Server Board page, the thermal performance will maintain a junction temperature of 56.3°C at a coolant flow rate of 4.2 liters per minute and a differential pressure of 1.05 psi.

  2. At a power dissipation of 1.4 watts per square millimeter, representing an extreme level of power dissipation, the thermal performance will maintain a junction temperature of 90.3°C at a coolant flow rate of 38.4 liters per minute and a differential pressure of 7.77 psi.



    * Flow rate is proportional to cross-sectional area;
    pressure is proportional to flow length

We offer a new thermal paradigm