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# Salmon Engineering

## Sitemaps

- [XML Sitemap](https://salmonengg.com/sitemap.xml): Contains all public & indexable URLs for this website.

## Posts

- [A Brief History of Chiplets](https://salmonengg.com/a-brief-history-of-chiplets/) - This history is extracted from an SCV-EPS lecture given by John Lau of Unimicron Technology Corporation in Milpitas, California, on March 9, 2023. 2013 Xilinx was the first to implement a chiplet design, working with TSMC and employing their chip-on-wafer-on-substrate (CoWoS) 3D IC process. A large FPGA SOC was split into 4 smaller chips using
- [IFTLE 545: Chiplet Definition and Standardization](https://salmonengg.com/iftle-545-chiplet-definition-and-standardization/) - The following blog by Phil Garrou provides a welcome discussion about chiplets, including a standard definition. I wanted this blog to cover the recent whitepaper by Siemens’ EDA division on chiplet model standardization, and it will, but first I need to go over some introductory material on chiplets, and specifically, chiplet definition. Let me explain
- [This is first blog Post!](https://salmonengg.com/this-is-first-blog-post/) - Several potential solutions exist for patterning large area panels with a resolution of 2-micron line and space or better. This resolution is required for flip chip mounting of modern chips having a pad pitch of 40 microns or less. Use of flat panel display (FPD) technology. The CANON MPAsp-E903T is a wide-field lithographic system capable

## Pages

- [Home](https://salmonengg.com/) - Home Welcome to Electronic Innovations! An innovative approach to water-cooling of electronic systems enables disruptive improvements in power density, energy efficiency, design cost and manufacturing cost. Manufacturing technology is described, applicable to both air and water-cooled modules. The modules can be integrated into advanced servers, and the servers integrated into advanced supercomputers. The proposed compact
- [Water-cooled Server](https://salmonengg.com/water-cooled-server/) - Water-Cooled Server WATER-COOLED SERVER 800 gpm 1.9MW 4U rack format We offer a new thermal paradigm Contact Us Today
- [Microelectronic Module](https://salmonengg.com/microelectronic-module/) - Microelectronic Module MICROELECTRONIC MODULE The substrate is patterned with redistribution layers (RDLs) having a half-pitch of 2µm or less, to accommodate flip chip mounted components such as high bandwidth memories (HBMs) having a bump pitch of 40µm or less. The circuit assemblies comprise semiconductor devices of all types, including bare die, chiplets, and stacked devices
- [Patent Portfolio](https://salmonengg.com/patent-portfolio/) - Patent Portfolio Patent Portfolio A substantial patent portfolio has been developed, with several patents pending. Please contact Salmon Engineering for further details. We offer a new thermal paradigm Contact Us Today
- [Contact Us](https://salmonengg.com/contact-us/) - Contact Send Us A Message Please enable JavaScript in your browser to complete this form.NameEmail *SubjectComment or Message *EmailContact Us Contact Info Call Us 1-650-814-1076 Our Email peters@salmonengg.com Our Location 1885 S. Springer Rd. Unit B, Mountain View, CA 94040-4052
- [News & Events](https://salmonengg.com/news-events/) - News & Events

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## Categories

- [News & Events](https://salmonengg.com/category/news-events/)